February 7, 2019
Congratulations to Hariklia “Lili” Deligianni, PhD ’88 (Alkire), who was elected to the National Academy of Engineering!
A retired research scientist at IBM, Deligianni played a leading role in solving a number of technical challenges in the electronics industry. She and her colleagues introduced electrochemical processes in solder bump technology, now a standard practice for joining silicon chips to packages. She also co-invented the copper electrodeposition process for on-chip interconnects, which has revolutionized the capability of computer chips, allowing computers to run faster.
Deligianni was one of 86 new members and 18 foreign members announced by the NAE today. She was elected for her work in “electrochemical processes used by major microelectronic chip producers worldwide.”
Election to the NAE is among the highest professional distinctions accorded to an engineer. Academy membership honors those who have made outstanding contributions to “engineering research, practice, or education, including, where appropriate, significant contributions to the engineering literature” and to “the pioneering of new and developing fields of technology, making major advancements in traditional fields of engineering, or developing/implementing innovative approaches to engineering education.”
Also recently elected to the NAE was Richard D. Braatz, who was a faculty member in the Department of Chemical and Biomolecular Engineering from 1994 to 2010. Braatz, currently the Edwin R. Gilliland Professor of Chemical Engineering at the Massachusetts Institute of Technology, was elected for his contributions to diagnosis and control of large-scale and molecular processes for materials, microelectronics, and pharmaceuticals manufacturing.