Robert Sankman

Robert Sankman joined Intel in 1980 as a process engineer during the startup of Intel’s Fab 6 chip manufacturing facility in Arizona. He retired as Intel Fellow and was director of package pathfinding in the Assembly Test Technology Development group. He was responsible for directing the definition of integrated circuit packaging and assembly activities for Intel’s advanced logic products. Earlier in his Intel career, he was the group’s design and core competency manager, a position in which he designed product packages and provided modeling support for assembly technology development. He holds 50 U.S. patents in the field of electronic packaging and was honored with three Intel Achievement Awards—two in the area of semiconductor fabrication and one in semiconductor packaging.